Industry News: delamination bare board (Page 2 of 42)

Martin K. Anselm, Ph.D., to Present “Electronic Manufacturing Fundamentals” at SMTA Capital Chapter June Tutorial

Industry News | 2016-05-16 20:32:11.0

The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing, an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. Registration is required for this learning event.

Surface Mount Technology Association (SMTA)

Courses at IPC ESTC to Explore Advanced Technology, Reliability and Product Performance Systems Approach to Product Realization Emphasized

Industry News | 2013-04-17 11:13:48.0

IPC ESTC will feature eight professional development courses examining packaging, materials, design and assembly considerations in electronics, from bare board to end-product, May 20–21 and May 23, 2013, at The New Tropicana in Las Vegas.

Association Connecting Electronics Industries (IPC)

SMTA Europe's Harsh Environments Conference Session 3 to Focus on Advanced Test

Industry News | 2018-04-11 20:04:01.0

SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

Clariant introduces innovative halogen- and cobalt dichloride-free Type 2 Non-reversible Humidity Indicator Cards to ensure integrity of moisture sensitive electronic components

Industry News | 2019-10-22 12:34:34.0

Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.

Clariant Cargo & Device Protection

IPC Releases IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards

Industry News | 2015-08-20 13:42:15.0

IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industry Results for February 2010

Industry News | 2010-03-27 19:35:44.0

BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter Presents “Electronic Manufacturing Fundamentals” Tutorial Program on June 2nd at Zentech Manufacturing

Industry News | 2016-04-13 16:56:22.0

The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. New this year! Get a $20 EARLY BIRD discount on regular member and non-member registrations if registration is completed by midnight on April 30, 2016. Registration is required for this learning event.

Surface Mount Technology Association (SMTA)

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Industry News | 2017-08-06 19:39:48.0

The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

IPC Honors Members at APEX For Outstanding Contributions.

Industry News | 2001-01-23 10:52:31.0

IPC has honored 27 members at IPC SMEMA Council's Electronic Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA for their contributions to IPC and the electronics industry.

Association Connecting Electronics Industries (IPC)


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