Industry News: delamination bare board (Page 10 of 42)

Electronics Manufacturers Report Slowing Growth and a Cautiously Optimistic Outlook

Industry News | 2019-12-09 16:03:06.0

Growth is slowing worldwide and the industry’s outlook is less optimistic than in previous quarters, although it is still generally positive, according to the results of IPC’s fourth-quarter 2019 Pulse of the Electronics Industry survey. Based on responses from 82 companies that make up a representative sample of the industry, global third-quarter 2019 sales growth, averaging 3.0 percent, was at its lowest level since the quarterly survey began in mid-2017. The sales growth the respondents predicted for the current quarter is down further, averaging 2.6 percent.

Association Connecting Electronics Industries (IPC)

2003 Designers Learning Symposiums Take Shape

Industry News | 2003-09-11 16:50:12.0

The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer

Association Connecting Electronics Industries (IPC)

IPC Honors Members at IPC Printed Circuits Expo� 2003

Industry News | 2003-04-23 08:39:30.0

For their contributions to IPC and the electronics industry

Association Connecting Electronics Industries (IPC)

IPC Honors 66 Members at IPC SMEMA Council�s APEX� 2003

Industry News | 2003-04-17 11:35:44.0

Honored for their contributions to IPC and the electronics industry

Association Connecting Electronics Industries (IPC)

BEST Releases 2nd Half Training Schedule for 2016

Industry News | 2016-05-25 18:26:38.0

BEST's 2nd half of 2016 schedule including more dates and classes in Detroit.

BEST Inc.

LPKF to showcase affordable UV-Laser cutting system for bare rigid and flexible PCB circuit boards at the 2012 IPC APEX Expo

Industry News | 2012-01-21 17:21:43.0

LPKF will showcase the MicroLine 1120 P in Booth #2335 at the upcoming IPC APEX Expo.

LPKF Laser & Electronics

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

Industry News | 2021-12-22 09:30:32.0

YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast flow and easily reworkable underfill.

YINCAE Advanced Materials, LLC.

SMART Group to Host Moisture-Sensitive Components/PCB Handling Workshop

Industry News | 2011-12-30 23:20:54.0

SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.

The SMART Group

YINCAE's DA158N Die Attach Materials withstanding -273°C

Industry News | 2022-03-30 14:59:52.0

YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.

YINCAE Advanced Materials, LLC.

January 25-27, San Diego, CA – Booth 1100

Industry News | 2022-01-10 16:28:20.0

Once again, customers looking for leading-edge test solutions can come to Seica's booth 1100 and view the future of Flying Probe test in the form of the new PILOT VX platform. Fast, Powerful and Smart: the Pilot VX raises the bar of flying probe test performance, with cutting-edge solutions that address the fundamental concerns of electronic board manufacturers looking to optimize their investment.

SEICA SpA


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