Industry News: emi attachment (Page 1 of 1)

DEK and Gore Introduce snapSHOT� Board-Level EMI Shielding Solution

Industry News | 2003-02-14 08:03:50.0

Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans

ASM Assembly Systems (DEK)

Saelig Introduces Economical Siglent SSA3075X-R 7.5GHz Real-Time Spectrum Analyzer

Industry News | 2020-04-07 16:11:15.0

The SSA3075X-R extends the Siglent SSA3000X series to add real-time spectrum analysis capabilities for intermittent and frequency-hopping signals used in commercial communications and 5G applications.

Saelig Co. Inc.

Conductive Compounds Announces Formable Conductive Inks for Molded Plastic Assemblies

Industry News | 2012-07-31 15:57:01.0

Printable, formable conductive inks that can be applied to a flat plastic substrate and then molded into various shapes offer exciting new opportunities to engineers and designers trying to incorporate internal electronic circuitry into molded automotive and aircraft interior parts, as well as a wide variety of industrial and consumer electronic assemblies...

Conductive Compounds, Inc.

Miniaturized Wireless Medical Wearables

Industry News | 2018-07-17 13:56:31.0

Tiny RF chip antennas are no longer relegated to PCB “keep out” area, allowing product designers to further miniaturize wireless biosensors and medical wearables

Johanson technology

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