Industry News | 2008-02-11 15:39:37.0
San Diego � February 8, 2008 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it has teamed with SEHO, the leading manufacturer of soldering equipment, to co-develop communication software that seamlessly integrates the process traceability and monitoring system with the reflow oven.
Industry News | 2019-08-28 00:00:21.0
Saki Corporation will exhibit its 2Di-LU1 2D bottom-side automated optical inspection (AOI) system at NEPCON Asia along with its 3D AOI and solder paste inspection (SPI) systems and M2M capabilities for ensuring defect-free electronics for automotive and mobile applications. To demonstrate the speed and effectiveness of its 2D bottom-side AOI, Saki is collaborating with Ersa, Wertheim, Germany, to inspect the bottom-side of a printed circuit board assembly (PCBA) after Ersa's SMARTFLOW 2020 selective soldering process.
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