Industry News | 2013-03-13 13:43:59.0
Formulated to address the limitations of alternative products, Henkel Electronic Materials announces the commercial availability of two encapsulants for selective protection of environmentally-susceptible components. The materials, LOCTITE ECCOBOND UV9060F and LOCTITE ECCOBOND EN 3707F, deliver an impermeable barrier to potential environmental influences and offer manufacturers cure process flexibility and deposition traceability.
Industry News | 2008-04-22 21:03:49.0
To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.
Industry News | 2012-04-04 15:31:23.0
Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is
Industry News | 2010-04-16 01:50:52.0
Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.
Industry News | 2016-09-21 15:44:21.0
From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
Industry News | 2008-04-10 21:33:27.0
Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas.
Industry News | 2012-04-27 19:07:14.0
Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.
Industry News | 2010-08-17 15:04:10.0
Henkel’s Adhesive Electronics business has relocated its headquarters to a new facility in Irvine, California which the company fully expects will help further its innovation initiatives.
Industry News | 2009-10-09 23:08:26.0
NASHVILLE — October 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will feature AQUANOX® A4241 PCB and Stencil Cleaner at the upcoming Wisconsin/Great Lakes Expo & Tech Forum, scheduled to take place Tuesday, November 10, 2009 at the Wyndham Airport Hotel in Milwaukee, WI.
Industry News | 2016-03-27 14:19:07.0
Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
