Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-04-23 07:36:42.0
SMTA announces registration is now open for the 2nd Annual eSMART Factory Conference on June 20-21, 2019 at the Dearborn Inn in Dearborn, MI, USA. Co-organized by Global SMT & Packaging magazine and SMTA, this conference brings together the key technologies shaping the electronics manufacturing industry including software systems and processes, augmented reality and alternative systems.
Industry News | 2019-10-23 15:26:19.0
Almost 90 percent of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the United States and China on each other’s imports, and some are investing less in the United States and hiring fewer workers as a result.
Industry News | 2003-01-27 09:31:04.0
The Conference Will Take Place March 22-27
Industry News | 2015-08-20 13:42:15.0
IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
Industry News | 2013-02-19 18:26:34.0
In recognition of their extraordinary contributions to IPC and the electronic interconnect industry, Ray Prasad, Ray Prasad Consultancy Group and Lionel Fullwood, WKK Distribution Ltd., were honored with the IPC Raymond E. Pritchard Hall of Fame Award.
Industry News | 2019-03-03 18:35:28.0
During IPC APEX EXPO 2019, the IPC Education Foundation launched six IPC student chapters at: Auburn, North Carolina State, Sacramento State, Central Carolina Community College, Gwinnett Technical College, and Michigan Technical University. The student chapters at North Carolina State, Central Carolina Community College and Michigan Technical University provide examples of how industry can partner with education institutions to prepare engineering students with knowledge specific to the electronics industry.
