Industry News: fr4 warp module (Page 1 of 2)

Suggested 14 and 16 Layer Board Layouts

Industry News | 2018-10-18 10:43:28.0

Suggested 14 and 16 Layer Board Layouts

Flason Electronic Co.,limited

New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications

Industry News | 2012-03-30 18:48:18.0

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

EMS TECHNOLOGY, INC.

Engineered Material Systems Introduces New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive

Industry News | 2013-06-12 18:03:39.0

Engineered Material Systems, announces the debut of its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

Engineered Materials Systems, Inc.

One article take you to know AL-based board

Industry News | 2019-11-05 22:10:56.0

Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.

Headpcb

Acculogic to Introduce Flying Scorpion FLS980 Series III System at the IPC APEX Expo

Industry News | 2013-01-17 09:26:23.0

Acculogic Inc will introduce its new Flying Scorpion FLS980 Series III in Booth #1019 at the upcoming IPC APEX Expo

Acculogic Inc.

Würth Elektronik offers the best contact between flex-rigid PCBs and ZIF connectors

Industry News | 2010-05-05 23:20:11.0

Niedernhall – PCB specialist Würth Elektronik once again demonstrates its competence in system solutions and customer support; now offering one-stop flex-rigid PCB solutions with ZIF contacts and custom designed ZIF connectors.

Würth Elektronik GmbH & Co. KG

SIPLACE Very-High-Force Head features placement force of 70 N

Industry News | 2013-01-12 12:27:34.0

With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.

ASM Assembly Systems GmbH & Co. KG

A multifunctional printed circuit board, integrating sensor and evaluation electronics, has passed initial customer production release tests

Industry News | 2009-04-23 21:31:21.0

W�rth Elektronik's cantilever sensors revolutionise applications such as ERP and identification systems

Würth Elektronik GmbH & Co. KG

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Industry News | 2014-03-20 14:21:26.0

COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.

AI Technology, Inc. (AIT)

Acculogic’s FLS980 Series III to Make European Debut at Productronica

Industry News | 2013-10-24 16:29:45.0

Acculogic GmbH will showcase the new FLS980 Series III Flying Probe System in Hall A1, Stand 465 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Acculogic Inc.

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