Industry News: green contamination on component leads (Page 1 of 4)

SMTA South East Asia Technical Conference on Electronics Assembly Program Finalized

Industry News | 2016-02-10 15:50:38.0

SMTA is excited to announce the finalized program and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia.

Surface Mount Technology Association (SMTA)

SMTA South East Asia Technical Conference on Electronics Assembly Technologies Call for Presentations Announced

Industry News | 2009-04-23 20:54:01.0

MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:

Surface Mount Technology Association (SMTA)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Practical Support on Cleaning and Contamination Monitoring Processes Printed Board Assembly Cleaning and Contamination Testing Center to Debut at IPC APEX EXPO 2013

Industry News | 2012-12-03 19:52:39.0

Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

SMTA Announces 2017 Educational Programming

Industry News | 2017-02-05 10:18:08.0

The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.

Surface Mount Technology Association (SMTA)

IMAPS New England Symposium & Expo 2019 is just 4 weeks away! Visit YINCAE on May 7, 2019

Industry News | 2019-04-10 10:19:18.0

(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.

YINCAE Advanced Materials, LLC.

Hands on Master Class Series from Bob Willis

Industry News | 2017-03-06 05:20:47.0

For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology http://www.bobwillis.co.uk

ASKbobwillis.com

MicroCare Expert Educates the Electronics Industry on Optimizing Benchtop Cleaning

Industry News | 2017-11-05 08:55:02.0

Removing contamination from printed circuit boards remains a huge reliability and warranty issue for PCB manufacturers. One of the cleaning experts from MicroCare Corp., the industry’s leading manufacturer of critical cleaning products, addressed that specific issue at the Texas Cleaning and Reliability Workshops in Austin and Dallas on Oct. 23rd and 25th, 2017.

MicroCare Corporation

Shining a Spotlight on the Industry’s Key Issues

Industry News | 2010-08-10 15:01:40.0

Numerous industry-related conferences to be held at NEPCON South China

Reed Exhibitions

Kyzen’s Dr. Bixenman to Hold IPC Webinar on Cleaning Highly Dense Circuit Assemblies

Industry News | 2011-06-16 15:01:31.0

Kyzen announces that Dr. Mike Bixenman will host an upcoming IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011 from 10-11 a.m. CST.

KYZEN Corporation

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