Industry News: issues soldering gold flash (Page 5 of 7)

Indium Corporation Expert to Host 5G Connectivity Webinar

Industry News | 2020-07-22 04:48:07.0

Indium Corporation's Jenny Gallery, Product Specialist, will host a webinar focused on gold-based thermal solutions for 5G connectivity. There will be two sessions on Wednesday, Aug. 5, during International Microwave Symposium's (IMS) virtual conference. The first session will be held at 8 a.m. Eastern Time (1 p.m. British Time/8 p.m. Malaysia Time), with the second at 2 p.m. Eastern Time (7 p.m. British Time/2 a.m., Aug. 6, Malaysia Time).

Indium Corporation

AIM to Debut NC259 Solder Paste at the 2012 IPC APEX Expo

Industry News | 2012-01-20 15:08:03.0

AIM will debut its new NC259 Solder Paste chemistry in Booth #2804 at the upcoming IPC APEX Expo.

AIM Solder

AIM to Highlight NC259 No-Clean Solder Paste at NEPCON China 2012

Industry News | 2012-04-17 11:22:21.0

AIM will highlight its NC259 no-clean solder paste chemistry in Booth #1A02 at the upcoming NEPCON China 2012.

AIM Solder

SMART Group Launches Next FREE Guide in the Series: PCB Surface Finish Defect Guide

Industry News | 2017-04-04 15:22:45.0

SMART Group announces that the “Printed Circuit Solderable Finish Defect Guide” has been printed and is available free of charge.

The SMART Group

Murrietta Circuits Offers Re-Tinning Services

Industry News | 2012-10-29 15:37:50.0

Murrietta Circuits now offers an entire menu of Re-Tinning capabilities

Murrietta Circuits

Circuit Technology Center to Increase Component Level Modification Services Capacity

Industry News | 2021-08-25 16:20:31.0

Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Industry News | 2013-05-07 13:45:19.0

AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.

AIM Solder

AIM’s Karl Seelig to Discuss Overcoming Challenges of QFNs at SMTAI 2011

Industry News | 2011-09-28 19:53:50.0

AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.

AIM Solder

Henkel’s Hysol FP5201 NCP Enables New Copper Pillar Interconnect Technology

Industry News | 2010-07-29 14:45:16.0

Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.

Henkel Electronic Materials

See FCT Assembly’s Technical Experts in Pennsylvania Next Week

Industry News | 2014-08-07 17:58:07.0

FCT Assembly today announced plans to exhibit at the SMTA Philadelphia and SMTA West Penn Expos.

FCT ASSEMBLY, INC.


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