Industry News | 2014-04-11 09:15:04.0
IPC – Association Connecting Electronics Industries®, working in partnership with the Automotive Industry Action Group (AIAG), the Conflict-Free Sourcing Initiative (CFSI) and the Japan Electronics and Information Technology Industries Association (JEITA), recently published IPC-1755, Conflict Minerals Data Exchange Standard, to help suppliers and their customers effectively facilitate conflict minerals data exchange along the entire global supply chain.
Industry News | 2020-03-08 16:49:19.0
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2021-12-09 08:41:38.0
CES 2022: Joint Presentation of Optical In-vehicle Network Solution for Autonomous Vehicles
Industry News | 2020-12-18 11:29:38.0
New Sizes for the Electrical Double-Layer Energy Storage Capacitors Range from 10 mm x 20 mm to 12.5 mm x 40 mm, With Capacitance From 5 F to 22 F
Industry News | 2021-12-13 12:52:59.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Industry News | 2017-11-07 17:26:19.0
Altus will be introducing visitors of Productronica to a range of innovative capital equipment from its impressive portfolio of suppliers including the rereleased MODI relabelling station.
Industry News | 2021-11-02 21:34:08.0
Vehicle HMI system is a bridge between driver and vehicle. With the application of all LCD instrument, central control screen, HUD and other electronic products, the driver can more intuitively understand the real-time information of the vehicle. In recent years, many high-end models at home and abroad are equipped with full LCD instrument display screen supporting three screen interconnection. Facing the huge and complex system data, how should the embedded HMI system deal with it? With the breakthrough in key technologies of new energy vehicles and intelligent networked vehicles, the development trend of automotive electronics has become irreversible. The application scope of cockpit LCD instrument is expanding with the addition of safety configuration and infotainment system.
Industry News | 2013-10-04 16:59:24.0
JUKI released LED Mounter JX-300LED, a specialized model with efficient function and performance for LED board production.
Industry News | 2002-07-16 18:58:23.0
GiveMePower and At Work Computers Partner
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.