Industry News: lamination (Page 1 of 34)

Rogers� Q4 Sales Up 7%

Industry News | 2003-02-13 07:53:53.0

Belgian Laminate Plant Set to Come Online

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Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

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PIAD spa Acquires Crossley & Bradley from Receiver of AIK Industrie GmbH

Industry News | 2003-04-04 08:21:57.0

The deal emphasizes PIAD�s commitment to being a major supplier to the UK printed circuit market and enhances Crossley & Bradley�s position as a leading distributor of copper-clad laminates in the UK

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DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

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Shipley Company Announces Distribution Agreement with Unichem Industries

Industry News | 2003-04-18 08:31:57.0

Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.

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Taiyo America Announces Partnership Alliance

Industry News | 2003-03-31 09:43:08.0

With Schedectady International to develop, manufacture, and sell waterborne photoimagable etch resists and soldermasks in North America.

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Parlex Corporation Announces Third Quarter/FY2003 Conference Call

Industry News | 2003-05-14 08:22:59.0

All interested parties are invited to participate in Parlex's quarterly teleconference, which will be held on Wednesday, May 14, 2003 at 10:00 AM Eastern Time.

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DuPont Electronic Technologies To Appoint Insulectro as National Distributor for Circuit Materials

Industry News | 2003-06-16 08:33:59.0

This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.

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Rogers Corporation Reports 50% Increase in Earnings

Industry News | 2003-04-25 08:11:22.0

Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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