Industry News: leaching at h solder (Page 1 of 24)

GPD Global to Roll Out FPC Dispense Platform at Productronica

Industry News | 2013-10-09 10:29:04.0

GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.

GPD Global

GPD Global to Demonstrate World-Class Dispensing Systems at the IPC APEX EXPO

Industry News | 2013-01-16 19:22:48.0

GPD Global will exhibit in Booth #2633 at the upcoming IPC APEX EXPO. Live demonstrations will be given for a number of systems from the company's dispensing line.

GPD Global

SMTA China Presents Seven Best-Paper/Presentation Awards and Two Best Exhibit Awards at SMTA China East 2015 Conference/NEPCON China 2015

Industry News | 2015-04-30 19:57:55.0

SMTA China announces that it presented awards for seven papers at the SMTA China East 2015 Conference Award Presentation Ceremony, held on Tuesday, April 21, 2015 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

IPC Hand Soldering Competition Winner Crowned at productronica 2013

Industry News | 2013-11-21 17:52:49.0

Despite chilly temperatures in Munich last week, things got “heated” as 43 competitors went soldering iron to soldering iron at IPC’s Hand Soldering Competition at productronica 2013, November 12–15. Emerging victorious and taking first place, a cash prize of €500 and a new soldering station from JBC Tools, was Jacek Majchrzak, PartnerTech, Poland.

Association Connecting Electronics Industries (IPC)

IPC Honors Members at APEX 2002

Industry News |

Association Connecting Electronics Industries (IPC)

2002-01-31 09:33:43.0

IPC Hand Soldering Competition Winner Crowned at productronica 2015 Jacek Majchrzak, PartnerTech Poland, takes second consecutive win

Industry News | 2015-12-01 11:22:02.0

A record number of 47 European competitors went soldering iron to soldering iron at IPC’s Hand Soldering Competition at productronica 2015, November 10–13 in Munich. Taking first place with a score of 501 points out of a maximum 506, was Jacek Majchrzak, ParterTech Poland. Majchrzak was also crowned first place winner at productronica 2013.

Association Connecting Electronics Industries (IPC)

The SMTA Capital Chapter to Host a Meeting on November 7th at ZESTRON Americas

Industry News | 2017-10-05 05:56:21.0

The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.

Surface Mount Technology Association (SMTA)

Winners of IPC Hand Soldering and Rework Competition at NEPCON Vietnam 2022 Announced

Industry News | 2022-09-21 08:21:42.0

In conjunction with NEPCON Vietnam 2022, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam on September 14–16, 2022. Held for the first time in person since the COVID-19 pandemic, this ninth competition series welcomed 33 competitors from 17 Vietnamese electronics companies.

Association Connecting Electronics Industries (IPC)

Best Technical Papers at IPC APEX EXPO 2022 Selected

Industry News | 2022-01-14 17:06:40.0

Expanded technical conference award categories include NextGen and Student Research

Association Connecting Electronics Industries (IPC)

Changes in Key Electronics Manufacturing Standards Focus of Half-day Workshops at Electronics Midwest

Industry News | 2010-08-25 14:54:48.0

Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.

Association Connecting Electronics Industries (IPC)

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