Industry News: moire or laser (Page 1 of 2)

Soldering Support Online or On Site

Industry News | 2016-07-10 12:08:40.0

All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry

ASKbobwillis.com

Laser Bar Bonding with AuSn or Indium on the New Automatic Sub-Micron Bonder FINEPLACER� FEMTO

Industry News | 2007-11-27 12:28:45.0

FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.

Finetech

TRI presents New High-Reliability 3D AOI Solution

Industry News | 2021-01-11 15:33:48.0

Test Research, Inc. (TRI) is pleased to announce the release of the high-reliability TR77000QM SII3D AOI.

TRI - Test Research, Inc. USA

Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

New Gerber Layer Format Specification

Industry News | 2021-03-12 04:55:13.0

Ucamco has published a new revision of the Gerber Layer Format Specification.

Ucamco

PARMI Names Horizon Sales Rep Group of the Year

Industry News | 2022-02-07 17:31:44.0

Horizon Sales is pleased to announce that it was named manufacturers' representative group of the year by PARMI during the recent IPC APEX EXPO in San Diego, CA. The company had the top sales in 2021 for PARMI's 3D inspection systems for the electronics assembly industry.

Horizon Sales

Koh Young Neptune C+ Wins Global Technology Award for Best New Test Inspection System

Industry News | 2021-11-16 12:17:11.0

Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is excited to announce Global SMT & Packaging recognized the new Neptune C+ for dispensing process inspection (DPI) with the prestigious Global Technology Award in the category of Test Inspection. Koh Young accepted the award in a hybrid ceremony during the 2021 Productronica trade show in Munich, Germany.

Koh Young America, Inc.

Koh Young Neptune C+ Wins Prestigious Global Technology Award for Best Test Inspection during Productronica 2021

Industry News | 2021-11-22 06:44:40.0

Koh Young is excited to announce Global SMT & Packaging recognized the new Neptune C+ for dispensing process inspection (DPI) with the prestigious Global Technology Award in the category of Test Inspection. Koh Young accepted the award in a hybrid ceremony during the 2021 Productronica trade show in Munich, Germany.

Koh Young America, Inc.

VisionMaster Transforms Benchtop SPI with A600 Introduction at APEX

Industry News | 2015-03-02 09:42:34.0

PORTLAND, MAINE – VisionMaster® introduced the first member of the VisionMaster 600 family, the latest in the evolution of the original VisionMaster® world-class benchtop SPI systems at APEX. The fully-automatic A600 features the smallest 3D non-contact SPI sensor head in the world, which was crafted by miniaturizing the technology in the popular A500X. A smaller sensor translates to a more efficient motion system, lower vibrations and settling time – which results in higher accuracies at higher speeds. A600's fully automatic set-and-forget SPI system is optimal for monitoring and tweaking your solder paste printing process. The standard A600 handles larger board sizes – 18 in. x 16 in. – and is very economical at $29,999.

VisionMaster, Inc.

Koh Young Shows Full Suite of Solutions During IPC APEX Expo

Industry News | 2021-02-25 14:20:16.0

Koh Young is the industry leader in True3D™ measurement-based inspection solutions. We invite you to connect with us at the virtual IPC APEX Expo during 08-12 March 2021. At the event you can learn, collaborate, and bond with Koh Young from your office. Yes, the setting is different from in past years. Yet, we stay committed to the event and will highlight our innovative inspection solutions. What's more, you can request to schedule a free machine demonstration to see how we can solve your electronics inspection challenges.

Koh Young America, Inc.

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