Industry News: mpm and 3d (Page 1 of 44)

International Wafer-Level Packaging Conference and Exhibition

Industry News | 2011-01-18 14:37:31.0

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

Industry News | 2021-12-21 14:47:13.0

The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Technology, Economics and Electronics to Converge at IPC Technology Market Research Conference (TMRC)

Industry News | 2013-09-17 17:28:51.0

Industry thought leaders will present a high-level look at new technologies against a backdrop of domestic and global economics during the IPC Technology Market Research Conference (TMRC), September 25–26 in Chicago.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2015-08-16 09:43:18.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology

Industry News | 2008-07-24 17:38:17.0

Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.

ASYMTEK Products | Nordson Electronics Solutions

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

SMTA International Program Finalized and Registration Is Now Open!

Industry News | 2015-06-11 22:59:06.0

The SMTA International Technical Committee has finalized their best program to date and registration is now open. The conference will include 130 papers, 19 short courses, and three focused symposiums. Start planning now to attend SMTA International this fall!

Surface Mount Technology Association (SMTA)

IPC and SMTA Announce High Performance Electronics Assembly Cleaning Symposium and Call for Papers

Industry News | 2008-04-08 22:55:31.0

Minneapolis, MN=ADThe Surface Mount Technology Association (SMTA) and IPC announced the High Performance Electronics Assembly Cleaning Symposium will take place on October 28-29, 2008 in Rosemont, IL. This will be the industry premier conference on cleaning for electronics assembly.

Surface Mount Technology Association (SMTA)

Geoffrey Doyle, Jabil Circuit Inc., to be Keynote Speaker at SMTA Capital Chapter’s Expo and Tech Forum on August 23rd

Industry News | 2018-07-10 10:42:26.0

The SMTA Capital Chapter is pleased to announce Geoffrey Doyle of Jabil Circuit Inc. as Keynote speaker for the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

2009 International Wafer-Level Packaging Conference Dates and Location Announced

Industry News | 2008-12-02 14:39:08.0

Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.

Surface Mount Technology Association (SMTA)


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