Industry News: paste sticking (Page 1 of 5)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Transition Automation Debuts Electronic Paste Manager Self-Cleaning Squeegee System

Industry News | 2008-04-07 23:25:00.0

Transition Automation, Inc. is unveiling for the first time the Permalex Paste Manager, a Self-Cleaning Squeegee System based on a microprocessor controlled torque actuators.

Transition Automation, Inc.

FINE LINE STENCIL Premiers Slic Blade™ Squeegee Blades

Industry News | 2008-06-11 18:26:39.0

FINE LINE STENCIL announces Slic Blade™, its newest line of squeegee blades, and a SMT VISION Award winning product.

FCT ASSEMBLY, INC.

FINE LINE STENCIL Wins a 2008 VISION Award for Its Slic-Blade Squeegee Blades

Industry News | 2008-04-08 22:33:32.0

COLORADO SPRINGS, CO � April 2, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a SMT VISION Award in the category of Assembly Tools for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, April 2, 2008 ceremony that took place in Las Vegas during APEX 2008.

FCT ASSEMBLY, INC.

FINE LINE STENCIL Wins a 2008 Advanced Packaging Award for Its Slic-Blade Squeegee Blades

Industry News | 2008-07-19 14:36:57.0

COLORADO SPRINGS, CO � July 16, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded an Advanced Packaging Award in the category of Handling Equipment/Fixtures for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, July 16, 2008 ceremony that took place at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

FCT ASSEMBLY, INC.

Kyzen’s Informative Presentation at NEPCON South China Earns Best Paper Award

Industry News | 2013-08-30 09:54:58.0

Kyzen announces that it received a Best Paper award for its recent presentation during NEPCON South China, which was held from August 27-29, 2013.

KYZEN Corporation

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

FCT Assembly to Premier DEK Nano-ProTek Stencil Technology at IPC APEX EXPO

Industry News | 2011-02-15 19:58:07.0

FCT Assembly will introduce new nano-coating stencil technology, along with its latest solder paste technologies, in Booth #262 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

FCT ASSEMBLY, INC.

FCT Assembly Rolls Out UltraSlic™ Stencil with Nano-Coating

Industry News | 2011-01-31 22:19:11.0

FCT Assembly is pleased to introduce the new UltraSlic™ Stencil with Nano-Coating. The addition of nano-coating to the UltraSlic™ stencil further increases the performance gap between it and any other stencil technology available today.

FCT ASSEMBLY, INC.

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