Industry News | 2001-02-06 14:27:18.0
Juki Automation Systems unveiled its innovative new screen printer for use in printed circuit board production and SMT applications at APEX 2001 in San Diego, CA. The KS-1700 features a Juki original floating and rotating squeegee head design. The squeegee head is equipped with a linear guide and cylinder, allowing it to rotate 90 degrees, and enabling the operator to easily clean front and back blades.
Industry News | 2010-03-26 23:54:25.0
The Balver Zinn Group announces that Cobar Europe BV will introduce its new Aquasol Branded Water Soluble solder paste in booth #1876 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2022-08-14 14:26:09.0
SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2022-05-18 13:07:51.0
SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2010-01-19 13:47:38.0
January 2010 — The Balver Zinn Group announces that Cobar Europe BV will exhibit a complete range of advanced soldering materials from bar solder to SMT solder paste to high-performance fluxes at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 26-28, 2010 at the Sheraton Kauai Resort, on Kauai, Hawaii.
Industry News | 2003-03-11 09:04:04.0
Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
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