Industry News | 2013-09-24 14:34:40.0
In the cool November weather in Munich, IPC’s Hand Soldering Competition is sure to heat things up at productronica 2013, stand A3.415.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Industry News | 2011-09-19 16:00:50.0
Count On Tools will introduce its latest developments in SMT nozzles and consumables in Booth #323 at the upcoming SMTA International Conference & Exhibition
Industry News | 2012-10-30 11:13:05.0
IPC APEX EXPO® Hand Soldering Competition February 19–20, 2013, at the San Diego Convention Center.
Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Industry News | 2013-02-27 15:04:56.0
February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.
Industry News | 2010-03-05 10:01:36.0
The latest developments in SMT Nozzles and Consumables, New Website, $1000 Sweepstakes, Free Nozzles, and more! Stop by booth #1870!
Industry News | 2010-03-27 20:10:28.0
Gainesville, GA, - Count On Tools, Inc. is excited to invite you to IPC Apex Expo 2010, taking place at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada, USA on April 6-8, 2010. Count On Tools will be introducing their latest developments in SMT nozzles and consumables, as well as the launch of their new website with online store at their booth #1870.
Industry News | 2012-10-16 18:56:39.0
IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.