Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2006-11-21 11:32:36.0
November 21, 2006
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2016-04-21 00:17:09.0
SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
Industry News | 2012-10-03 16:55:18.0
Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo
Industry News | 2012-01-24 17:11:07.0
Finetech will highlight the FINEPLACER® core rework system in Booth #3020 at the upcoming IPC APEX Expo,.
Industry News | 2013-01-16 13:48:03.0
Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO
