Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Industry News | 2023-03-16 13:50:51.0
Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, manufactures RPS Automation Selective Solder Risers for the Opus range of selective soldering machines. The nozzles are machined from special alloy steel with N65 magnets. The easy drop-in replacements are designed for long-lasting, dependable performance.
Industry News | 2016-06-15 20:10:27.0
The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 25 - 29, 2016 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings.
Industry News | 2008-06-11 17:44:06.0
LIVERMORE, Calif.--(BUSINESS WIRE)--June 10, 2008--Adept Technology, Inc. (NASDAQ:ADEP), the leading provider of intelligent vision-guided robotics and global robotics services, today announced it will present the Adept Quattro s650 robot on its booth (Hall B5, Stand 220) at Intersolar 2008, the world's largest solar trade fair, in Munich, Germany, June 12-14.
Industry News | 2015-12-13 21:07:44.0
Sono-Tek Corporation is proud to announce the sale of its 4,000th fluxer to Jabil Circuit Inc. This milestone was achieved in Sono-Tek’s 40th year in business.
Industry News | 2011-06-16 15:01:31.0
Kyzen announces that Dr. Mike Bixenman will host an upcoming IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011 from 10-11 a.m. CST.
Industry News | 2011-07-26 21:41:43.0
Kyzen announces that Dr. Mike Bixenman hosted an informative IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
