Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2012-04-03 13:02:23.0
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC’s most widely-used standard.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2007-10-04 17:14:39.0
Tempe, AZ - September 24, 2007 - FINETECH announces that it will demonstrate the Fineplacer� CRS 10 compact rework system in booth 210 at the upcoming SMTA International exhibition, scheduled to take place October 9-10, 2007 in Orlando, FL.
Industry News | 2008-02-28 15:40:26.0
Tempe, AZ - January 2008 - FINETECH will display the Fineplacer� CRS 10 Compact Rework System in booth #577 at APEX 2008, scheduled for April 1-3, 2008 in Las Vegas.
Industry News | 2007-10-23 16:19:57.0
Tempe, AZ - October 23, 2007 - FINETECH will demonstrate its fixed configuration, complete rework system, at the upcoming Nepcon East exhibition on October 30-31, 2007 at the Boston Convention Center.
Industry News | 2009-09-26 16:57:04.0
OK International has launched its new MRS-1000 Modular Rework System. A convection rework system for the removal and placement of BGA/CSP and SMT components, the Modular Rework System integrates state-of-the-art assembly technologies to widen application possibilities and enhance productivity going forward.
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