Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2016-05-16 20:32:11.0
The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing, an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. Registration is required for this learning event.
Industry News | 2017-04-22 11:59:17.0
SMT Xtra today announced plans to exhibit at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. SMT Xtra Ltd. will celebrate 10-years of providing cost savings to the surface mount industry at the event with a 36m2 booth in Hall 7, Booth 4-409. Established in 2007, the company is based in the UK, with satellite offices in Hungary and China, and recently launched a sister company in the U.S.
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Industry News | 2012-06-05 14:09:17.0
SMTA China announces that it successfully organized the SMTA China West Conference 2012.
Industry News | 2016-04-13 16:56:22.0
The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. New this year! Get a $20 EARLY BIRD discount on regular member and non-member registrations if registration is completed by midnight on April 30, 2016. Registration is required for this learning event.
Industry News | 2013-03-07 19:40:38.0
The need to look at the big picture or the whole electronic system rather than focusing on its individual parts is the impetus of the IPC Electronic System Technologies Conference and Exhibition (ESTC).
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