Industry News | 2009-02-21 17:56:00.0
BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
Industry News | 2014-07-15 14:38:39.0
Kyzen announces that it will exhibit AQUANOX® A4639 Electronic Assembly Aqueous Solution at the SMTA Philadelphia Expo & Tech Forum, scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia in New Jersey.
Industry News | 2014-08-19 09:34:26.0
Kyzen will showcase its new stencil cleaning products at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, September 9, 2014 at the John Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2021-10-31 04:57:58.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2022-01-03 07:38:59.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2024-09-30 20:02:53.0
PEMTRON is pleased to announce its participation in NEPCON Nagoya 2024, where it will showcase its cutting-edge equipment designed for precision inspection in semiconductor and electronics manufacturing. From October 23-25, visitors to PEMTRON's booth will experience demonstrations of the JUPITER 3D X-ray Inspection System, POSEIDON Wafer Warpage Measurement and FC-BGA Bump Inspection System, APOLLON Package Inspection System, and the 8800WIR Wafer Inspection System.
Industry News | 2014-08-12 13:50:53.0
Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Industry News | 2016-09-11 12:17:53.0
KYZEN is pleased to announce that Dr. Mike Bixenman will present the recent paper “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” at SMTA International. The paper is co-authored by Mark McMeen and Jason Tynes from STI Electronics, and will be presented during the Manufacturing Excellence Track during Session MFX7 - Cleaning: New Techniques, on Thursday, September 29, 2016 at 9 a.m.
