Industry News | 2008-03-12 16:17:32.0
SMTA China announces that it will sponsor the upcoming SMTA Certified SMT Engineering Course and Examination from 8-10 April 2008 in Shanghai in conjunction with NEPCON China 2008. SMTA China and ChinaECNet will jointly organize the first course with support by NEPCON China 2007.
Industry News | 2009-02-21 17:56:00.0
BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
Industry News | 2018-12-08 03:15:55.0
SMT Book – Surface Mount Technology Book PDF
Industry News | 2018-12-08 03:17:14.0
SMT Book – Surface Mount Technology Book PDF
Industry News | 2012-03-05 13:45:09.0
Nihon Superior has received a 2012 NPI Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire.
Industry News | 2020-11-19 20:55:18.0
Temperature cycling test or thermal cycle testing is done on substances to determine the immunity of vulnerability to alternating extremes of low and high temperatures. You can utilize temperature cycling test chambers to test nearly all commercial goods to determine how they withstand extreme temperature changes. The intent of analyzing a product under these conditions is to detect changes in the goods' characteristics and assess the failure incidence of distinct substances and thermal expansion coefficients.
Industry News | 2012-01-26 22:47:26.0
SEHO Systems GmbH announces that Christian Ott will present a paper titled “Reduction of Voids in Solder Joints: An Alternative to Vacuum Soldering” during the Voiding 1: Process and Test Technical Session on Tuesday, February 28, 2012 from 1:30-3 p.m. at the San Diego Convention Center in San Diego, CA. The paper, authored by Rolf Diehm, Mathias Nowottnick and Uwe Pape, will discuss voids in solder joins as one of the main problems for power electronics.
Industry News | 2011-10-08 20:53:49.0
Seica presenting the Pilot V8 Flying Prober with automatic loader, the innovative in-circuit and functional line tester, Compact SL, and the model Top-bottom of Firefly Laser Selective Soldering.
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