Industry News: thermal and pad (Page 1 of 62)

Multi-Functional System Dispense with Pick and Place

Industry News | 2016-11-07 16:28:47.0

GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.

GPD Global

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Reflow oven zone temperature set up and thermal profile

Industry News | 2018-10-18 08:42:00.0

Reflow oven zone temperature set up and thermal profile

Flason Electronic Co.,limited

IPC Releases IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

Industry News | 2021-02-15 14:41:46.0

– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK Demonstrates the Helios Dispenser for 1K and 2K Materials for Electronics Manufacturing at Bondexpo 2019

Industry News | 2019-09-13 07:56:55.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.

ASYMTEK Products | Nordson Electronics Solutions

Stencil aperture considerations for QFN chips

Industry News | 2018-10-18 08:40:47.0

Stencil aperture considerations for QFN chips

Flason Electronic Co.,limited

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

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