Industry News | 2018-01-16 10:40:31.0
Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160
Industry News | 2018-05-14 10:30:22.0
The world's first commercial diamond filled underfill.
Industry News | 2018-12-31 16:23:07.0
YINCAE is attending iMAPS New England
Industry News | 2018-12-31 16:21:47.0
YINCAE is attending iMAPS 2019- Boston!
Industry News | 2018-01-16 10:34:16.0
Press Release: Low Temperature Reflowable Underfill Material: SMT 160L
Industry News | 2018-09-04 15:51:06.0
YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2018-02-14 10:15:17.0
Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA
Industry News | 2022-08-16 16:11:50.0
YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill. Using UF 158HA can eliminate cleaning process and pollution from the cleaning process, and simplify the manufacturing process.
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