Industry News | 2003-05-14 08:22:59.0
All interested parties are invited to participate in Parlex's quarterly teleconference, which will be held on Wednesday, May 14, 2003 at 10:00 AM Eastern Time.
Industry News | 2010-02-08 12:17:16.0
Naples, FL, February 3, 2010 — Trafalgar Publications Ltd., a global media provider of high-technology exhibitions, conferences and publications, announces Global Electronics Manufacturing Expo Brazil 2010. The event will be held at the prestigious, state-of-the-art Expo Center Norte in São Paulo, Brazil on October 5-7, 2010.
Industry News | 2003-04-11 08:53:18.0
This agreement establishes PCS as the exclusive representative of RSI in the UK and the Republic of Ireland.
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2018-09-19 21:06:54.0
IPC’s Hand Soldering Competition returns to the United Kingdom and What’s New in Electronics Live on September 25-26, 2018. This year, the competition will be run in association with Advanced Rework Technology Ltd.
Industry News | 2008-11-14 11:24:40.0
San Jose, CA � The 5th Annual International Wafer-Level Packaging Conference ended 2008 with success, bringing in its highest attendance yet.
Industry News | 2019-09-27 13:39:43.0
IPC, in conjunction with What’s New in Electronics Live and ART-- Advanced Rework Technology Ltd., conducted the IPC Hand Soldering Competition in Warwickshire, United Kingdom, on September 18-19, 2019. Twenty competitors demonstrated their soldering skills with the hope of winning the coveted hand soldering competition crown.
Industry News | 2022-02-10 17:06:48.0
Rafal Przeslawski, Xilinx takes top prize
Industry News | 2019-11-21 14:17:10.0
IPC’s Hand Soldering World Championship was held November 14 at productronica 2019 in Munich, Germany. This global event included 17 competitors representing companies in France, Hungary, Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam, United Kingdom, Japan, India, China and the Philippines.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
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