Industry News: universal instruments gsm2 placement system (Page 1 of 4)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Surface-Mount Systems Available by Online Auction

Industry News | 2003-04-29 08:15:12.0

Universal Instruments has added three of its latest Vantis multipurpose surface mount placement systems to its new online auction site.

Universal Instruments Corporation

Universal's Custom Tooling Paying Dividends for SEL

Industry News | 2015-03-16 17:08:55.0

Universal Instruments and Schweitzer Engineering Laboratories have enjoyed a successful partnership for many years, with Universal being the first capital equipment supplier to be awarded preferred-supplier status with SEL. Universal was also recognized as one of the company’s Supplier Success Stories of 2010.

Universal Instruments Corporation

Next Generation HSP Chipshooter Now Available

Industry News | 2001-01-29 14:50:16.0

Universal Instruments' next generation turret-style chipshooter, the 4797 HSP- originally showcased as a prototype last March at APEX 2000 - is now available as a standard production model to electronics manufacturers worldwide.

Universal Instruments Corporation

Universal Automates Odd Form Component Placement and Final Assembly in One Machine

Industry News | 2001-01-29 14:45:47.0

Addressing the electronics industry's need for a cost-effective odd form placement and final assembly workcell, Universal Instruments Corp. has launched the new Polaris Assembly Cell.

Universal Instruments Corporation

Universal's Innova Feeder Delivers High-Speed Bare Die to Mainstream Manufacturing

Industry News | 2011-03-21 10:39:09.0

Universal Instruments is embracing the convergence era of electronics assembly with the introduction of the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal's GenesisSC Platform without incurring costly packaging charges.

Universal Instruments Corporation

CBA Group Announces New Director of Human Resources

Industry News | 2009-08-19 19:44:14.0

The CBA Group, comprised of Universal Instruments Corporation and Hover-Davis, announces the appointment of Cynthia Palka to the position of Director, Human Resources. Cynthia will report to CBA Chairman and CEO Jean-Luc Pelissier.

Universal Instruments Corporation

Universal Moves to Meet Customers' Need for Fully Integrated Assembly Solutions

Industry News | 2001-01-29 14:52:11.0

Universal Instruments is taking a new approach to the sale and service of fully integrated assembly solutions. The company is forging a closer relationship with its sister companies in the Dover Technologies unit of Dover Corporation - DEK and Vitronics Soltec - to offer complete solutions that contract manufacturing customers are now demanding. These solutions are just one more way that Universal is empowering its customers' business.

Universal Instruments Corporation

Universal’s APL Attends Regional and National Technology Events

Industry News | 2010-11-04 14:21:08.0

Universal Instruments' Advanced Process Laboratory (APL) highlighted its Failure Analysis and Prototyping capabilities at recent regional SMTA shows, including the LI Chapter on October 13 and the Empire Chapter on October 19.

Universal Instruments Corporation

CBA Group Appoints Debbora Ahlgren Vice President of Marketing

Industry News | 2011-03-09 21:57:49.0

The CBA Group, comprised of Universal Instruments Corporation and Hover-Davis, announces the appointment of Debbora (Deb) Ahlgren as Vice President of Marketing, reporting to Jean-Luc Pelissier, CEO and President of CBA, Universal Instruments and Hover-Davis.

Universal Instruments Corporation

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