Industry News: usb 3.0 (Page 1 of 7)

Saelig Introduces USB 3.0 SuperSpeed Isolator For Electrical Isolation of USB Ports

Industry News | 2018-11-29 16:33:25.0

USB 3.0 SuperSpeed Isolator eliminates ground loops and ground potential differences and is ideal for measurement, industrial, automotive and audio technology applications.

Saelig Co. Inc.

Macrotron Systems, Inc. announces MacroVault™ USB 3.0 OEM/ODM flash drive solutions.

Industry News | 2012-11-26 14:09:09.0

Macrotron Systems announces availability of its MacroVault OEM/ODM USB 3.0 flash drive solutions.

Macrotron Systems

ADLINK Announces its First COM Express® 3.0 Type 7 Computer-on-Module

Industry News | 2016-08-02 13:02:42.0

ADLINK Technology announced its first computer-on-module (COM) based on the latest PCI Industrial Computer Manufacturers Group (PICMG®) COM Express® 3.0 specification with new Type 7 pinout, for which ADLINK lead development efforts to bring a server-grade platform and 10 Gigabit Ethernet (GbE) capabilities to a COM form factor. ADLINK’s Express-BD7 targets customers building space-constrained systems in industrial automation and data communication, such as virtualization, edge computing or other numerical applications, that require high density CPU cores balanced by reasonable power consumption.

ADLINK Technology, Inc.

ZDI to Demonstrate TAGARNO Digital Microscopes at the SMTA Rocky Mountain Expo

Industry News | 2023-03-06 17:21:56.0

TAGARNO announced that its representative, Zero Defects International (ZDI) will exhibit at the at the SMTA Rocky Mountain Expo & Tech Forum, scheduled to take place Wednesday, March 15, 2023 at the Sheraton Denver Downtown Hotel in Colorado. Zero Defects will showcase the TAGARNO ZIP Digital USB Microscope and the TAGARNO TREND Digital USB + HDMI Microscope.

Tagarno

ADLINK’s New IMB-M42H ATX Industrial Motherboard Empowers Combined Motion & Vision Applications

Industry News | 2014-11-04 17:37:56.0

ADLINK Technology today announced the release of its latest industrial ATX motherboard, the IMB-M42H, featuring the 4th Gen Intel® Core™ i7/i5/i3/Pentium®/Celeron® Processor family and Intel® H81 chipset. The IMB-H42H supports integrated motion/vision application-based platforms with a leading price/performance ratio. Combined high-bandwidth PCIe x16, PCIe x4 and conventional PCI slots, superior and rugged I/O connectivity and optimal design make it an optimum solution for industrial automation applications.

ADLINK Technology, Inc.

ADLINK Announces Rugged SWaP-optimized 6U VPX Radar Solution

Industry News | 2014-07-10 21:52:16.0

ADLINK Technology today announced the VPX6000, a rugged 6U VPX blade featuring a dual processor design based on quad-core 4th generation Intel® Core™ i7-4700EQ processors. The VPX6000 is a high performance blade designed to meet MIL-STD-810F, for harsh environments and provide the high-availability required for mission critical applications, including radar, sonar, UAV and UGV in defense and aerospace.

ADLINK Technology, Inc.

New Yorker Electronics Releases New Good-Ark ESD Protection Diodes

Industry News | 2020-12-18 11:26:19.0

Good-Ark Semiconductor's Low Capacitance DFN0603 Supplies Low Leakage, Fast Response and Bi-Directional TVS in 0603 Package

New Yorker Electronics

New Vishay Space-Saving Interface Protection Bidirectional and Symmetrical (BiSy) ESD-Protection Diode from New Yorker Electronics

Industry News | 2021-04-22 17:10:07.0

New ESD-Protection Diode with Wettable Flanks Features Low Capacitance to 0.37pF typical in the Compact DFN1110-3A Package

New Yorker Electronics

ADLINK Introduces New Products Based on 6th Generation Intel® Core™ and latest Intel® Xeon® Processors for High Performance Computing & Graphics Applications

Industry News | 2015-09-02 12:29:02.0

ADLINK Technology today announced the first of fourteen new products in various form factors based on the 6th generation Intel® Core™ i7/i5/i3 processors (codename Skylake) and latest Xeon® processors, coming to market in the second half of 2015 and early 2016. These current Intel® processor-based offerings feature an updated 14nm microarchitecture and added support for Ultra HD 4K resolution displays.

ADLINK Technology, Inc.

Brook Anco Corp. Exhibits TAGARNO Digital Microscopes at Design-2-Part Florida

Industry News | 2023-04-24 19:26:04.0

TAGARNO announced that its representative, Brook Anco Corporation, will exhibit at Design-2-Part Florida, scheduled to take place May 2-3, 2023 at the Orlando Convention Center. Brook Anco will showcase the TAGARNO FRONT and TAGARNO ZIP Digital USB Microscopes, along with the TAGARNO TREND Digital USB + HDMI Microscope in Booth #406.

Tagarno

  1 2 3 4 5 6 7 Next

usb 3.0 searches for Companies, Equipment, Machines, Suppliers & Information