Industry News | 2014-05-12 16:06:39.0
SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2015-09-03 16:37:18.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2012-04-03 13:02:23.0
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC’s most widely-used standard.
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2024-03-18 13:22:09.0
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Industry News | 2019-07-09 20:13:00.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.
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