Industry News: wpc (Page 1 of 1)

SIPLACE Very-High-Force Head features placement force of 70 N

Industry News | 2013-01-12 12:27:34.0

With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.

ASM Assembly Systems GmbH & Co. KG

Printed Electronics USA Pulls Ahead

Industry News | 2012-12-07 14:16:26.0

Printed electronics has reached its tipping point as evidenced by the world's largest event on the topic, Printed Electronics USA, now taking place in Santa Clara California, staged by the leading analysts on the subject, IDTechEx.

IDTechEx, Inc.

ASM Assembly Systems at the SMT Hybrid Packaging 2013 show

Industry News | 2013-03-12 13:42:20.0

With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.

ASM Assembly Systems GmbH & Co. KG

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