77 0402 reject results

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

Integrated Offset Placement in Electronics Assembly Equipment — The Answer for Solder Paste Misalignment

Integrated Offset Placement in Electronics Assembly Equipment — The Answer for Solder Paste Misalignment

SMT Express, Volume 2, Issue No. 4 - from SMTnet.com

Controlled Convection Rates

SMTnet Express - July 22, 2021

SMTnet Express - May 21, 2015

SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting Brent Fischthal, Michael Cieslinski; Panasonic Factory Solutions Company

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines

SMTnet Express - August 31, 2017

SMTnet Express - May 19, 2022