50 altera underfill results

HALT Testing of Backward Soldered BGAs on a Military Product

HALT Testing of Backward Soldered BGAs on a Military Product

SMTnet Express - December 10, 2015

- Altera Corporation , SungSoon Park, DongSu Ryu, M

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

SMTnet Express - April 17, 2014

SMTnet Express, April 17, 2014, Subscribers: 22675, Members: Companies: 13858, Users: 36080 A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. In order to meet

SMT Express, Issue No. 4 - from SMTnet.com

SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: An Engineer's Handbook of Encapsulation and Underfill Technology Author

SMTnet Express - February 27, 2014

SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

SMT Express, Volume 3, Issue No. 4 - from SMTnet.com

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com