93 gold star results

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

SMTnet Express - July 24, 2014

aluminum or gold wire. Gold wire provides the abilit

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

Reliability of BGA Solder Joints after Re-Balling Process

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Stencil Printing of Small Apertures