SMT Express, Volume 5, Issue No. 4 - from SMTnet.com Get Ready For NEPCON NEPCON East/Electro & Assembly East is converging this summer in Boston on June 9, 10 & 11 at the Bayside Expo & Conference Center . A production of Reed Exhibitions
SMTnet Express, January 30, 2014, Subscribers: 26500, Members: Companies: 13561, Users: 35693 Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries. by Andreas Thumm; IBL-Löttechnik GmbH As of today
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
in developing a lead free wave soldering process based on t
Lead-Free Wave Soldering News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! A Study of Lead-Free Wave Soldering AIM This brief study of lead-free wave soldering focuses
winsouce.jpg)
