974 philips topaz component pick height results

Solder Paste Inspection Technologies: 2D-3D Correlation

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

SMT Express, Volume 3, Issue No. 10 - from SMTnet.com

it was clear. An SMD component was placed on the surface o

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

01005 Assembly, the AOI route to optimizing yield

Printed Circuit Board Tracking with RFID: Speed, Efficiency and Productivity Made Simple

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

Soldering of SMD Film Capacitors in Practical Lead Free Processes

SMTnet Express - September 11, 2014

SMTnet Express - April 16, 2015

SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State