SMTnet Express, December 16, 2021, Subscribers: 26,148, Companies: 11,476, Users: 26,983 Assembly and Rework of Lead Free Package on Package Technology Miniaturization continues to be a driving force in both integrated circuit
SMTnet Express, December 13, 2018, Subscribers: 31,514, Companies: 10,659, Users: 25,503 Assembly Reliability of TSOP/DFN PoP Stack Package Credits: Jet Propulsion Laboratory Numerous 3D stack packaging technologies have been implemented
Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Package on Package (PoP
Assembly and Rework of Lead Free Package on Package Technology SMTnet Express March 15, 2012, Subscribers: 25003, Members: Companies: 8826, Users: 32832 Assembly and Rework of Lead Free Package on Package Technology by: Raymond G. Clark, Joseph D
SMTnet Express, June 2, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D
SMTnet Express, January 28, 2015, Subscribers: 22,279, Members: Companies: 14,195 , Users: 37,607 BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications Vern Solberg, Ilyas Mohammed - Invensas Corporation
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
