Novel Probing Concepts for Mass-Production Tests: Design and Challenges SMTnet Express June 15, 2012, Subscribers: 25268, Members: Companies: 8896, Users: 33235 Novel Probing Concepts for Mass-Production Tests: Design and Challenges First
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
SMTnet Express, August 23, 2018, Subscribers: 31,271, Companies: 11,024, Users: 25,118 Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications Bhupender Singh, Gary Menezes, Scott
SMTnet Express, April 18, 2019, Subscribers: 31,856, Companies: 10,750, Users: 26,011 Reliability of ENEPIG by Sequential Thermal Cycling and Aging Credits: Jet Propulsion Laboratory ENEPIG surface finish for PCB has now become a key surface
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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