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SMTnet Express - November 3, 2016

SMTnet Express, November 3, 2016, Subscribers: 26,550, Companies: 15,009, Users: 41,360 A Novel Method for the Fabrication of a High-Density Carbon Nanotube Microelectrode Array Adam Khalifa, Zhaoli Gao, Amine Bermak, Yi Wang, Leanne Lai Hang Chan

SMTnet Express - February 4, 2016

SMTnet Express, February 4, 2016, Subscribers: 24,087, Members: Companies: 14,964, Users: 39,872 Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test Derek Ong, Lok Teng Kee, Chuah Rhun

Strength of Lead-free BGA Spheres in High Speed Loading

Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general

SMTnet Express - July 10, 2014

SMTnet Express, July 10, 2014, Subscribers: 22902, Members: Companies: 13928, Users: 36450 Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads. Ren Huai-Hui, Wang Xi-Shu - Wind Power Engineer

SMT Express, Volume 3, Issue No. 7 - from SMTnet.com

Design Authors: Leonard Marks and James A. Cateri

SMTnet Express - June 20, 2019

intermetallic at the interface between the solder and a

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