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SMTnet Express - December 31, 2015

SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International

SMTnet Express - January 3, 2019

SMTnet Express, January 3, 2019, Subscribers: 31,567, Companies: 10,676, Users: 25,564 Risk Mitigation in Hand Soldering Credits: Metcal Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding

SMTnet Express - April 5, 2018

SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced

SMTnet Express - October 28, 2021

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SMTnet Express - December 27, 2013

SMTnet Express - January 5, 2014

SMTnet Express - July 23, 2015

SMTnet Express - October 3, 2019

SMT Express, Volume 2, Issue No. 5 - from SMTnet.com

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