SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
SMTnet Express August 22, 2013, Subscribers: 26219, Members: Companies: 13462, Users: 35081 Whisker Growth In Tin Alloys On Glass-Epoxy Laminate Studied By Scanning ION Microscopy and Energy-Dispersive X-Ray Spectroscopy by A. Czerwinski, A
SMTnet Express, April 11, 2019, Subscribers: 31,842, Companies: 10,737, Users: 25,981 Soldering Immersion Tin Credits: Atotech The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before
SMTnet Express, June 4, 2015, Subscribers: 22,829, Members: Companies: 14,364 , Users: 38,296 Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers David Pinsky, Elizabeth Lambert; Raytheon Integrators and designers
SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications
SMTnet Express, October 22, 2015, Subscribers: 23,631, Members: Companies: 14,705, Users: 39,186 Tin Whisker Risk Management by Conformal Coating Linda Woody, William Fox; Lockheed Martin Missiles and Fire Control; Lockheed Martin Corporation
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
