12 the head-in-pillow results

SMTnet Express - December 27, 2013

SMTnet Express, December 27, 2013, Subscribers: 26441, Members: Companies: 13537, Users: 35564 Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly by Mario Scalzo; Indium Corporation While the electronics manufacturing

SMTnet Express - July 6, 2017

SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMTnet Express - March 06, 2014

SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia

SMTnet Express - December 18, 2014

SMTnet Express - July 2, 2020

SMTnet Express, July 2, 2020, Subscribers: 28,589, Companies: 11,034, Users: 25,930 A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS Credits: Cookson Electronics Head-in-Pillow (HIP) defects are a growing concern

SMTnet Express June 6 - 2013, Subscribers: 26122

SMTnet Express - October 3, 2019

SMTnet Express - May 28, 2020

Aiming for High First-pass Yields in a Lead-free Environment