L typle Magazine Loader ULF-L-TN Description This equipment is used for automatic loading or unloading of PCB Board in SMT Production line. No.of Mzgazine Upper Conveyor:1 magazine lower conveyor; 1 mazagine Time feed Approx. 6 seconds or specif
Compact PCB loader LT-L-BN Description This equipment is used for automatic loading or unloading of PCB Board in SMT Production line. No.of Mzgazine Upper Conveyor:1 magazine lower conveyor; 1 mazagine Time feed Approx. 6 seconds or specify
Right Transportation Speed 1500mm/s Feeding Mode Section type transportation guide rail Rail Width Adjustment Automatic Communication Signal SMEMA PCB Positioning Upper and lower guide rail
YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
03012522-02 DISTANCE SENSOR 03012539-01 Retrof.kit Discharge Choke Coil 03012564-03 SERVO AMPLIFIER TBS/3S1 03012565S01 SERVO AMPLIFIER TDS120A3Z-01 03012658-01 WASTE CONTAINER /COMPONENTSCARRIAGE 03012823-01 SLOTTED HOLE STRIP 03012985S01 DEFL
03012203S01 C+P Head sleeve 12 star, modified for placement of comp. up 10.7mm. 03012357S01 LEAF SPRING / TAPE INPUT X 8 03012415S01 C+P head sleeve 6 star, modified for placement of comp. up 10.7mm. 03012416S01 LEAF SPRING / TAPE INPU
03012203S01 C+P Head sleeve 12 star, modified for placement of comp. up 10.7mm. 03012357S01 LEAF SPRING / TAPE INPUT X 8 03012415S01 C+P head sleeve 6 star, modified for placement of comp. up 10.7mm. 03012416S01 LEAF SPRING / TAPE INPU
UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
