High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds
Inspection of minimal wire thicknesses up to 15 µm
Reliable differentiation of wire courses
Recognition of defective bon
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
