General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
High viscosity impellor-less mixing fast and effective mixing simple bubble dispersion different size machies to suit USB connection to PC (software icluded) no machine clean-up no cross-contamination fast changeover of compound types reusable and di
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