Applicable Components： Small/Medium Size Radial Components Specifications: Taping Pitch 12.7 mm. Forming Pitch 2.5 ~ 7.5 mm. Forming Style: Straight, Bend in / out. Cam driven forming, stable & accurate. Long Lasting Mechanical Parts
Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef
Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.
Electronics Forum | Thu May 06 18:36:06 EDT 2004 | gustavo
I can help you, if define what type of components you used: Thru hole(axial,radial, pin insertion etc..) axial: milimetrics or standar(span of .200" or .350" ) radial 2.5mm , 5mm or 7.5 mm SMT (chip shooter(1206,0805,0603 ,sot 23 etc or more small
Used SMT Equipment | Pick and Place/Feeders
Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed ：18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co
Used SMT Equipment | Pick and Place/Feeders
Tact time: 0.20sec/chip with line array camera Simultaneous pick with 8 heads 0.45 sec/SO with line array camera Simultaneous pick with 4 heads 1.4 sec/QFP with line array camera Sequential pick with 4 heads 3.7 sec/QFP with area CCD camera In fin
Industry News | 2003-04-14 08:50:52.0
Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.
AOI technology has been proven as highly efficient for PCB manufacturing process improvement and quality achievement. EKT strives to be your most reliable AOI supplier. cathysun@ekt-tech.com mb/wechat: +86-18320811289
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
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