New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
DEK Galaxy SMT Stencil Printer Maximum printing surface： 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface： 510 mm* (X) x 508.5 mm (Y),
Electronics Forum | Wed May 26 14:14:17 EDT 1999 | Parvez Patel
hello all, I was just wondering, Is it true, that for a given package (area array), upto a certain limit, the assembly reliability improves with decreasing land pad diameters? Thankx in advance Parvez Patel Graduate REseacrh Associate SUNY-Binghamt
Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont
Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | Screen Printers
Momentum is designed to provide efficiency and speed. With its triple track conveyor rails and servo drive motors, for example, the Momentum Elite model orders the highest performance capacity in the series, making it the ideal printer for high volum
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Parts & Supplies | SMT Equipment
JUKI PAD ADAPTER PJ309050401 PJ308060501 BRANCH PJ308065101 BRANCH PJ309040003 REDUCER 4-10 PJ309040004 CROSS JOINT PJ309040006 ELBOW PJ309040502 AIR BRANCH PJ309050401 PAD ADAPTER PJ309060002 IKEI TRIPLE 6-4 PJ309060005 DIFFERENT DIAMETER
Parts & Supplies | Pick and Place/Feeders
QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine Description: Model: ADBPN-8143 Description: 3.7mm Used in FUJI QP341 Machine supply All FUJI Machine model Spare Parts, Original new inventory quantities,Original used an
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Technical Library | 2007-01-03 16:36:58.0
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8532845-qp341-smt-machine-fuji-nozzle-3-7m-adbpn-8143-in-pick-and-place-machine.html
1.8m MELF AA08410 Nozzle 2.5G with rubber pad AA08500 Nozzle 3.7G with rubber pad AA07200 Nozzle 5.0G with rubber pad AA07310 Nozzle
| https://www.eptac.com/ask/soldering-wires-to-pads-with-a-lap-joint/
I’m making the presumption of: Not knowing the width of the pad to which the leads are to be soldered and the diameter of the first wire
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