Industry Directory | Manufacturer
Boasting a complete EMS (electronic manufacturing services) production, engineering, and distribution facility we differentiate our services through: ��Aggressive pricing ��Rapid, responsive turnaround ��Personalized customer service�
Industry Directory | Consultant / Service Provider / Manufacturer
A Contract Manufacturing company specializing in Printed Circuit Board Assembly, Quick Turn Prototype Services, and Direct Fulfillment.
http://www.flason-smt.com/product/I-PULSE-0201-01005-03015-Nozzle.html I-PULSE 0201 01005 03015 Nozzle SMT Nozzle I-Pulse Nozzle I-PULSE 0201 01005 03015 Nozzle Usage:I-Pulse pick and place machine Product description: I-PULSE 0201 01005 0301
New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250M Adhesive roll 2 rolls Width adjustment Manual PCB size 50﹡50~330﹡250 mm Weight About 100 kg Product description: SMT PCB Cleaner UC-250M, Adhesive roll 2 rolls, Width adjustment Manual, PCB size 50﹡50~330﹡250 mm, Weight
Used SMT Equipment | Pick and Place/Feeders
Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-driven Z- and ?-axis motors Standard on-the-fly vision alignment cameras for c
Used SMT Equipment | Pick and Place/Feeders
MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive
Industry News | 2003-02-07 08:34:04.0
Featuring Individual Instructors who, for Approximately 90 Minutes Each, will Speak on a Timely and Specific Topic
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
SMTnet Express, May 4, 2023, Subscribers: 24,706, Companies: 11,774, Users: 27,931 █ Electronics Manufacturing Technical Articles Stencil Printing 008004/0201 Aperture Components This paper will focus on the application requirements
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal. This results in the PCB pads or the
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_AdvMicroSMT.pdf
in size from 0603, 0402, 0201, 01005, as well as multi-leaded extra fine pitch devices. This course is an extensive and repetitive “hands-on” experience
