Industry Directory | Consultant / Service Provider / Manufacturer
Qmax offers comprehensive PCB design services for OEMs in Medial, Aerospace and Telecom markets. We have successfully designed hundreds of boards that meet the most stringent compliance requirements.
Industry Directory | Manufacturer
Electronic Contract Manufacturer (Malaysia). Experience in lead-free production since 2001. Service: AI/SMT/Box Build, Turnkey. Component size 0201 and above. Capacity: 150KKpt/mth(2005)..
JUKI RS-1R Next Generation Smart Fast Modular Mounter Model JUKI RS-1R Pick and Place Machine Conveyor Specification standard Boar Size minimum 50*50mm 1 buffer 650*370mm(single clamping) 9
RS-1 JUKI Fast Smart Modular Pick and Place Machine The JUKI RS-1 assembly machine has a high assembly speed up to 42000 comp / hour, (29500 comp / hour IPC9850). Mounting accuracy: ± 0.035 mm (Cpk ≧ 1). a wide range of mounted components: 0201 … 74
Electronics Forum | Fri Feb 22 10:46:04 EST 2008 | mulder0990
Yes, we have. We do have one machine that can place the 0201 parts. I have bought some 0.4mm tape leaf covers and replaced the 0.7mm covers on some CP6 0802 feeders. I calibrate the feeders as tight as I can and make sure the feeders that we use a
Electronics Forum | Thu May 04 20:33:12 EDT 2023 | stephendo
Are you talking imperial or metric? A metric 0201 is three sizes smaller than an imperial 0201. The paper describes metric 0201 as about the size of a grain of sand. That would be pretty fine sand.
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 2020M JUKI chipmounter Product number: KE - 2020M Products in detail Suitable for small components of high-speedSMT placement machine The characteristics of As the single module module concept, canaccording to production capac
Used SMT Equipment | SMT Equipment
JUKI KE2050 SMT 13,200CPH: Chip (laser identification / actual production efficiency), laser stickers titles x 1 (4 nozzle), 0603 (Imperial 0201) chip to 20mm square element, or 26.5 * 11mm. 0402 (Imperial 01005) chip factory option specifications:
Industry News | 2019-08-12 20:03:57.0
MIRTEC, ‘The Global Leader in Inspection Technology,’ today announced that it will display its award-winning 3D AOI, 2D AOI and SPI Inspection Systems in booth #1C55 with Mir Tech-win at the upcoming NEPCON ASIA (NEPCON SOUTH CHINA) exhibition, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Parts & Supplies | Semiconductor & Solar
JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2023-05-02 19:16:57.0
1.5 with a 150μm specification window. For 0201 components, the minimum requirement is CpK > 2.0 with a 100μm specification window. The spec window may need to be reduced down to 75μm if the controls for high volume manufacturing are insufficient. Also directly impacting the placement quality is the ability to apply sufficient solder consistently to the board. The goal is to maintain current printing practices, but the effect of powder size will be examined. This paper will evaluate the impact of placement accuracy and solder powder size on 0201 manufacturing quality.
Siemens HS60 parameters Placement head type: 12-nozzle collection and placement head Number of cantilevers: 4 Theoretical mounting rate: 60000cph Component range: 0.6mm x 0.3mm (0201) to 18.7mm x 18.7mm The highest placement accuracy (4 sigma):
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Over 20 Years Experience with SMT Processes at Large and Medium Sized Companies like Hitachi, Nokia, Siemens, and Variosystems Troubleshooting SMT Process Deficiencies and Recommending Short Term and Long Term Solutions. Developing Technical
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, September 2, 2021, Subscribers: 26,737, Companies: 11,436, Users: 26,825 Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices
KingFei SMT Tech | http://www.smtspare-parts.com/sale-10185163-ipulse-fv7100-pick-up-nozzle-k04-nozzle-size-1-8-1-1-size.html
Ipulse FV7100 Pick Up Nozzle K04 Nozzle Size ø 1.8/ ø1.1 Size Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/0402-min-size-land-pattern_topic30_page2.html
0402 Min Size Land Pattern - PCB Libraries Forum - Page 2 Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login 0402 Min Size Land Pattern
