Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
Industry Directory | Manufacturer / Standards Setting / Certification / Training Provider
Manufacturer of solders, high-quality anodes, alloys and wires for the electronic industry and surface refinement applications. Lead free products for the electronic industry are one of the core competencies of the company.
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
New Equipment | Solder Materials
FCT Assembly has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to th
Electronics Forum | Thu Nov 13 20:48:04 EST 2003 | davef
There a number of studies like this published by component fabricators. Many can be found on the net. For instance: http://www.amd.com/us-en/assets/content_type/DownloadableAssets/Pb-free_Board-level_reliability_study.pdf
Electronics Forum | Tue Nov 11 12:49:13 EST 2003 | Carol
Could you direct me to a Standard or Study that has used this termination with 67/37 tin/lead solder please? I am looking for the recommended reflow temperature requirements and reliability issues for the completed product. We are receiving this type
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Industry News | 2012-07-23 18:32:34.0
The SMTA Capital Chapter is pleased to invite you to the upcoming Capital Expo and Tech Form on August 23, 2012 from 9:00 am until 3:00 pm at Johns Hopkins Applied Physics Lab.
Industry News | 2012-03-29 18:55:00.0
Providing convenient and cost-effective staff development, IPC announces its 2012 spring webinars for April, May and June. Each one-hour webinar is focused on technical challenges facing the electronics manufacturing industry, offering companies a great opportunity to bring IPC technical information to a large number of employees at one time.
Parts & Supplies | Pick and Place/Feeders
FCM (w/ TiN coating), TOPAZ, EMERALD & YV100II, COMET/SAPPHIRE, YV88X, YV100X, MG & YVG200X, MC & MCX, etc.
Parts & Supplies | SMT Equipment
PCB Separator machine L100 Parameters: 1.maximum of board length: 200mm 2.board thickness:0.4~3mm 3.speed of sending board: it depends 4.material of knife:HSS 5.Volume:580mm(L) ×380mm(W) ×250mm(H) 6.weight:15kg Feature: 1.Minimize the inte
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Career Center | Danao city, Cebu Philippines | Engineering,Maintenance,Production,Quality Control
JUKI Chip Mounter Maintenance and Troubleshooting JUKI Chip Mounter programming MINAMI Solder Paste Printer Maintenance and Troubleshooting MINAMI Solder Paste Printer programming PWB Loader / Unloader Maintenance and Troubleshooting TAMURA Reflow ma
Career Center | Sta. Rosa, Philippines | Maintenance,Production,Technical Support
Complete knowledge in smt,aoi and reflow. 11 years working experienced in production and 5 years experienced in the field service job.
SMTnet Express, June 4, 2015, Subscribers: 22,829, Members: Companies: 14,364 , Users: 38,296 Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers David Pinsky, Elizabeth Lambert; Raytheon Integrators and designers
SMTnet Express, October 22, 2015, Subscribers: 23,631, Members: Companies: 14,705, Users: 39,186 Tin Whisker Risk Management by Conformal Coating Linda Woody, William Fox; Lockheed Martin Missiles and Fire Control; Lockheed Martin Corporation
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Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
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