New Equipment | Assembly Services
PentaLogix offers three levels of PCB assembly services: Kitted You provide all the parts, including the bare printed circuit boards and electronic components, and we assemble your boards using our state-of-the-art automated equipment. Partially
New Equipment | Solder Paste Stencils
Laser Cut Stencils: Industry trend toward miniaturization is leading to finer pitch requirements, high tolerances, and greater repeatability. Our state-of-the-art laser technology enables our customers to experience positional accuracy unattainable w
Electronics Forum | Sat Oct 07 16:31:56 EDT 2000 | Elfego
Tray the electroform stencil.
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Used SMT Equipment | Pick and Place/Feeders
Tact time: 0.20sec/chip with line array camera Simultaneous pick with 8 heads 0.45 sec/SO with line array camera Simultaneous pick with 4 heads 1.4 sec/QFP with line array camera Sequential pick with 4 heads 3.7 sec/QFP with area CCD camera In fin
Used SMT Equipment | Pick and Place/Feeders
Tact time: 0.20sec/chip with line array camera Simultaneous pick with 8 heads 0.45 sec/SO with line array camera Simultaneous pick with 4 heads 1.4 sec/QFP with line array camera Sequential pick with 4 heads 3.7 sec/QFP with area CCD camera In fin
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r
Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
| https://www.smtfactory.com/What-are-the-working-principles-and-usage-skills-of-Full-auto-SMT-Stencil-Printer-id3506468.html
? What are the working principles and usage skills of Full-auto SMT Stencil Printer? Views: 0 Author: Dongguan Intercontinental Technology Co.,Ltd. Publish Time: 2021-09-16 Origin
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, 1.0mm pitch, various solder ball diameters SnPb solder paste Test vehicle one: 2.36mm thick (93 mil), FR-4, 8 internal planes, OSP finish Thermal cycling: 0°C-100
